AIBO III DRY ASHER
12-inch conceptual dry asher platform with EFEM, FOUP, Load Lock, Transfer Chamber and triple process module architecture.
Concept Platform Overview
Aibo III Dry Asher is a conceptual 300 mm platform developed for project-specific semiconductor plasma-processing requirements. The system concept combines front-end wafer handling, vacuum transfer and multiple process modules within a scalable architecture.
- 300 mm / 12-inch wafer concept
- Triple process module architecture
- EFEM and FOUP handling
- Load Lock and Transfer Chamber
- Vacuum Robot
- Configurable process architecture
- Project-specific engineering review
Public information is presented as concept-level positioning and design-target wording. Project requirements must be reviewed before any final equipment configuration is defined.
System Architecture
The Aibo III concept is organized around front-end wafer loading, vacuum transfer and multiple process modules. The public website describes the equipment architecture at a high level without exposing internal control details.
EFEM
Front-end module concept for 300 mm wafer loading and FOUP interface.
FOUP 1 / 2 / 3
Three FOUP positions are considered for high-volume wafer-handling requirements.
Load Lock
Vacuum interface concept between atmospheric wafer loading and transfer architecture.
Transfer Chamber
Central vacuum transfer area connecting Load Lock and process modules.
Vacuum Robot
Wafer transfer concept for routing wafers among Load Lock and process modules.
PM1 / PM2 / PM3
Triple process module concept for scalable dry asher process capacity.
Detailed system integration requirements are reviewed through a controlled technical discussion. Restricted engineering documents are not published.
Public Design Specifications
The following items are public concept-level specifications for discussion. Final values depend on project requirements, engineering validation and selected system configuration.
| Product Name | Aibo III Dry Asher |
|---|---|
| Wafer Size | 12" / 300 mm |
| ICP | 13.56 MHz |
| Temperature | 100-270 C |
| RF Power | 700-5000 W |
| System Configuration | EFEM, FOUP 1 / 2 / 3, Load Lock, Transfer Chamber, Vacuum Robot, PM1 / PM2 / PM3 |
| Chamber Architecture | Triple Process Module Concept |
| Equipment Availability | Design target subject to final configuration and system validation |
| Reliability Targets | Defined according to final system configuration and project validation requirements |
| Wafer-Handling Performance | Subject to system validation and application requirements |
These items are not released production specifications. Technical evaluation is required before project commitment.
Triple Process Module Concept
The Aibo III concept allocates three process modules around the vacuum transfer architecture to support higher parallel processing capacity and project-specific process integration.
PM1
Process module position for configurable plasma-processing requirements.
PM2
Second process module position supporting parallel module architecture.
PM3
Third process module position considered for scalable process capacity.
Vacuum Robot
Wafer transfer concept between process modules and Load Lock.
Transfer Chamber
Central vacuum area for wafer routing among process modules.
Load Lock
Vacuum interface concept for wafer movement between atmospheric and vacuum environments.
No fixed throughput, wafer-per-hour value or improvement percentage is published for Aibo III at this concept stage.
Wafer Handling and Platform Integration
EFEM and FOUP Handling
Front-end wafer handling concept for 300 mm cassette integration.
Vacuum Transfer Architecture
Central vacuum transfer chamber connecting Load Lock and process modules.
Project-Specific Integration
Final configuration, chamber design, process requirements and fab interfaces are reviewed for each project.
Detailed system integration requirements are reviewed through a controlled technical discussion. Restricted engineering documents are not published.
Concept Gallery
Images in this section are Aibo III design concept renderings. They are not production equipment photographs or customer installation images.
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Discuss Your 300 mm Dry Asher Project
Provide wafer size, process application, chamber requirement, required capacity and fab integration needs for conceptual review.