ACMEWIN RESEARCH AND DEVELOPMENT
Acmewin develops RF, pressure-control, vacuum, equipment-integration and wafer-handling solutions for semiconductor equipment applications.
Innovation Overview
Acmewin develops in-house equipment solutions for RF power distribution, chamber pressure control, RF matching, vacuum motion and wafer-handling integration.
RF Technology
RF power distribution and matching-related equipment development.
Pressure and Vacuum Control
Pressure controller, valve and vacuum system integration support.
Equipment Integration
Engineering review for replacement, upgrade and platform integration.
Wafer Handling and Cooling
Loadlock-side cooling and wafer-transfer architecture development.
Products & Solutions
Acmewin 2000 W RF Power Splitter
RF distribution solution developed to support selected multi-load or dual-load plasma system configurations.
Compatibility: Selected Aspen II ICP system configurations
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AIC1201 Pressure Controller
Pressure-control solution developed for semiconductor vacuum systems and process chamber integration.
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AIC-A2 RF Matching Network
Configurable RF matching solution for plasma process equipment and RF power-delivery applications.
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MDV-018 Throttle Valve Replacement
Vacuum throttle-valve replacement solution designed for legacy equipment upgrade and pressure-control integration.
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Obsolete Parts Replacement
Replacement and sourcing review for discontinued semiconductor equipment components and assemblies.
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Patent certificates are displayed as public summaries. Full-resolution certificates, complete document text and internal files are not provided on the public page.
RF Power Distribution Technology
RF / Plasma Technology
Acmewin develops RF power delivery and distribution solutions for plasma equipment applications.
Heat Recovery Wafer Processing Equipment
Energy Saving / Wafer Processing
Acmewin develops energy-saving wafer processing equipment concepts with heat recovery design.
In-house Plasma Equipment Innovation
Dry Asher Platform
Acmewin continues to invest in dry asher platform technology, process control and semiconductor equipment integration.
Wafer Cooling Transfer Platform
Platform Integration
A wafer transfer platform integrating wafer cooling with the Loadlock-side wafer-handling architecture to reduce additional Robot travel and support higher parallel process capacity.
Patent Type: China Utility Model Patent
Patent Number: ZL 2023 2 0662780.0
Publication: CN 219370997 U
Grant Date: 2023-07-18
Patent Owner: Acmewin International Corp.
Wafer Cooling Platform Highlight
Wafer Cooling Transfer Platform
Acmewin integrates wafer cooling with the Loadlock-side handling architecture to reduce additional Robot travel and support triple-process-chamber platform development.
- Loadlock-integrated Cooling
- Cooling above Cassette Stage
- Reduced additional transfer path
- Third Process Chamber integration
- Patent-supported design
Related Technology / Products
Aibo II Dry Asher
Review the dry asher platform connected with wafer cooling platform development.
ViewDiscuss an Acmewin Technology or Product Requirement
Provide the equipment model, process requirement, current component configuration and technical objective for engineering review.