AIBO II DRY ASHER
Multi-application 4-inch to 8-inch dry asher platform with single, dual and triple chamber configurations for photoresist strip, de-scum, lite etch and plasma cleaning.
Product Overview
Aibo II Dry Asher is a configurable semiconductor plasma processing platform supporting multiple wafer sizes, applications and chamber configurations on a common system architecture.
- Multiple process applications
- Common platform architecture
- Single / Dual / Triple Chamber
- 4", 5", 6", 8" wafer support
- ICP plasma source
- Configurable RF, pressure and temperature control
- Loadlock-integrated cooling option
Applications and Platform Capabilities
Aibo II supports multiple plasma applications on a common platform. Final process suitability depends on wafer structure, material stack, chamber configuration and process recipe.
Photoresist Strip
Dry strip process support for selected post-lithography, post-implant and post-etch stages.
De-scum
Thin photoresist residue treatment for pattern preparation and downstream process readiness.
Lite Etch
Controlled plasma exposure for light surface treatment and selected process-development requirements.
Plasma Clean
Organic contamination and process residue treatment under configurable recipe conditions.
Single Chamber
Configuration review for lower-volume or focused process requirements.
Dual Chamber
Parallel process capability for higher utilization on selected process flows.
Triple Chamber
Expanded parallel process capacity enabled by the Loadlock-integrated cooling architecture.
Public Specifications
The following public specifications are provided for platform review. Final values and acceptance criteria depend on system configuration, process conditions and project validation.
| Product Name | Aibo II Dry Asher |
|---|---|
| Products | Strip / De-scum / Lite Etch / Plasma Clean |
| Platform | Multiple process applications on a common platform |
| Chamber Type | Single / Dual / Triple Chamber |
| ICP | 13.56 MHz |
| Wafer Size | 4", 5", 6", 8" |
| Strip Rate | > 4.5 µm/min @ 250°C |
| Temperature | 20–260°C |
| RF Power | Configurable by system configuration |
| Maximum RF Power | Up to 2000 W |
| Non-uniformity | < ±5% |
| Uptime | ≥95% |
Particle-related performance is evaluated according to wafer size, process conditions and measurement requirements. Triple-chamber configuration may improve productivity, equipment utilization and cost of ownership depending on process time and system configuration. The plasma architecture is designed to minimize electrical charge risk.
Loadlock-Integrated Cooling
Aibo II relocates the Cooling Stage from an independent Cooling Chamber to the Loadlock-side wafer handling area. Cooling levels are positioned above the Cassette Stages, reducing additional cross-station Robot movement while retaining wafer cooling capability.
3D System Configuration
Aibo II Configuration
Aibo II platform rendering for public configuration understanding.
Product Platform View
Aibo II Product
Aibo II product image for platform context.
- Cooling function is retained
- Cooling Stage moves into Loadlock-side handling area
- Cooling levels located above Cassette Stages
- Reduced additional Robot travel
- Original Cooling Chamber position becomes Process Chamber 3
- Increased parallel process capacity
Approximately 2 seconds of additional Robot handling per wafer may be associated with the cooling-related action. This is an engineering estimate for Robot handling only and does not represent cooling dwell time. Actual performance depends on Robot sequence, Loadlock scheduling, door timing, pump and vent time, cooling time and equipment configuration.
Productivity Engineering Study
The following public model is an engineering estimate for platform comparison and must be validated with actual equipment scheduling and process conditions.
| Process Range | Baseline Model | Aibo II Model | Estimated Gain |
|---|---|---|---|
| Robot-limited range | Approx. 150 WPH | Approx. 164 WPH | Approx. +9% |
| Around 80 seconds | Approx. 124 WPH | Approx. 164 WPH | Approx. +32% |
| 100 seconds and above | Chamber-capacity limited | Triple chamber parallel capacity | Engineering estimate approaches +50% |
| Process Time | Baseline WPH | Aibo II WPH | Estimated Gain |
|---|---|---|---|
| 40 s | 150.0 | 163.6 | 9.1% |
| 60 s | 150.0 | 163.6 | 9.1% |
| 80 s | 124.1 | 163.6 | 31.8% |
| 100 s | 105.9 | 158.8 | 50.0% |
| 120 s | 92.3 | 138.5 | 50.0% |
| 140 s | 81.8 | 122.7 | 50.0% |
Final throughput must be validated using actual Robot motion, door timing, pump and vent time, cooling dwell, Loadlock scheduling and process recipe.
Process Control and Monitoring
Aibo II supports operator-level process visibility and equipment monitoring functions for configurable production workflows.
HMI Control Interface
Aibo II GUI
Operator interface image for public HMI context.
HMI Close-up
Aibo II GUI
Control interface close-up for public product context.
- Recipe Management
- Process Trend Monitoring
- Alarm and Event History
- Equipment Status Monitoring
- Endpoint Monitoring
- Data History
- Fab communication review
Public GUI images are reviewed to avoid exposing non-public identifiers, access information, source paths or customer-specific process information.
Patent-Supported Platform Design
Aibo II platform development includes a patent-supported wafer cooling transfer concept integrating cooling functionality with wafer handling architecture to reduce additional Robot movement and support higher parallel capacity.
Wafer Cooling Transfer Platform
Public summary of a wafer transfer platform concept with integrated cooling functionality.
Loadlock-Side Cooling
Cooling architecture is positioned near the Loadlock-side handling sequence for platform integration.
Triple-Chamber Integration
The architecture supports a third process chamber configuration for increased parallel capacity.
The public website displays summary-level innovation information only. Full-resolution certificates, detailed technical files and non-public patent documents are not provided on the public page.
Gallery / Related Solutions
Gallery images use Aibo II equipment and control-interface assets only. Move-in photos are shown as installation context and are not used as the main Hero image.
Main Front View
Product
Aibo II Dry Asher front product image.
Front HMI Detail
Product
Aibo II front HMI detail.
Move-in Photo 01
Installation
Aibo II installation context photo.
Move-in Photo 02
Installation
Aibo II move-in front view.
HMI Interface
Control
Aibo II HMI control interface.
3D Configuration
Configuration
Aibo II 3D system configuration rendering.
Discuss Aibo II Configuration Requirements
Provide wafer size, process application, required throughput, chamber configuration target and current equipment information for engineering review.